Oculus Patent | Fluidic Pick-up Head For Small Semiconductor Devices

Patent: Fluidic Pick-up Head For Small Semiconductor Devices

Publication Number: 20180351030

Publication Date: 2018-12-06

Applicants: Oculus VR, LLC

Abstract: A method and system for manufacturing a device by picking and placing semiconductor devices from a carrier substrate to a target substrate using fluidic material as a transfer medium. The method may include releasing a first amount of fluidic material from a tip of a pick-up head to form a fluidic membrane on the tip, and bringing the fluidic membrane on the tip of the pick-up head in contact with a semiconductor device on a carrier substrate to attach the semiconductor device to the fluidic membrane. The method can further include releasing a second amount of the fluidic material from the tip of the pick-up head to separate the semiconductor device from the pick-up head and place the semiconductor device on a target substrate.

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