Oculus Patent | Substrate for mounting light emitting diodes with testing capabilities

Patent: Substrate for mounting light emitting diodes with testing capabilities

Publication Number: 20190018057

Publication Date: 2019-01-017

Applicants: Oculus

Abstract

Embodiments relate to testing LEDs by applying a voltage difference between anode electrodes and cathode electrodes of the LEDs using transistors and probe pads and determining whether the LEDs satisfy a threshold level of operability. A final substrate has transistors that apply the voltage difference to the LEDs via conductive traces and probe pads during testing mode. A gate voltage is applied to gate terminals of the transistors, a first voltage is applied to anode electrodes of the LEDs, and a second voltage is applied to cathode electrodes of the LEDs. After applying the voltages, turning on of the LEDs is observed. Embodiments also relate to testing current leakage in the final substrate with the transistors and the LEDs.

Background

This disclosure relates generally to semiconductor device testing, specifically to testing light emitting diodes (LEDs) using a substrate with active electronic components.

A HMD, such as for a virtual reality (VR) system, typically includes an electronic display that emits light to the eyes of the viewer, and an optical block positioned between the display and the eyes. The optical block includes optical components that receive light emitted from the electronic display, and adjust an orientation of the light such that the electronic display appears at one or more particular focal distances from user. Light emitting devices, such as micro LEDs (.mu.LEDs) are used in electronic display panels to emit light for image production.

A conventional method of producing an electronic display panel is to fabricate LEDs on chips that are picked and placed on a substrate of the electronic display panel. Each final electronic display panel may include a large number of LEDs (e.g., 1280 LEDs for each color). If each chip contains 20 LEDs of the same color, 64 chips are picked and placed on the substrate of the electronic display panel for each color. After all of the LEDs are picked and placed on the substrate, each of the LEDs are probed individually to detect whether the LEDs on the electronic display panel turn on. However, this method of individually probing each of the LEDs on the electronic display panel (1280.times.3 LEDs) is costly and time consuming. Further, the connection to each LED is not tested during individual mounting of the LED onto the substrate. Instead, the substrate fully mounted with all LEDs is subject to probing and testing. This may lead to wasted LEDs because the substrate with defective LEDs is not identified until all the LEDs are mounted onto the substrate.

Summary

Embodiments relate to testing LEDs by applying a voltage difference between anode electrodes and cathode electrodes of the LEDs and detecting turning on of the LEDs using transistors and probe pads. The LEDs are picked up from a first substrate and placed on a second substrate that includes transistors and probe pads. The first substrate may be a carrier substrate, and the second substrate may be a final substrate that is a part of an electronic display panel. The transistors may be used for testing connections of the LEDs to conductive components on the second substrate and may be placed in an inactive state during display operations of the final substrate following the testing.

In some embodiments, a plurality of LEDs of a same color are picked up from the first substrate and placed on the second substrate, connecting the anode electrodes and the cathode electrodes of the LEDs to conductive components on the second substrate. The second substrate is a final substrate that may be connected to a display driver circuit that is used during display operations after testing is completed. The final substrate has transistors that apply a voltage difference between the anode electrodes and the cathode electrodes of the LEDs during testing.

In some embodiments, when probe pads on the final substrate are applied with voltages, the terminals of the transistors are applied with voltages through conductive traces that connect the probe pads and the transistors. A gate voltage is applied to gate terminals of the transistors to turn the transistors on. After the transistors are on, a first voltage is applied to anode electrodes of the LEDs via one or more second probe pads, and a second voltage is applied to cathode electrodes of the LEDs via one or more third probe pads, the second voltage lower than the first voltage.

In some embodiments, when voltage difference is applied between the anode electrodes and the cathode electrodes of the LEDs, a detector is used to monitor the LEDs and to detect whether they turn on and satisfy a threshold level of operability. To simplify testing, the gate terminals of the transistors are connected together, the source terminals of the transistors are connected together, and the drain terminals of the transistors are connected together. Because the terminals of the transistors are connected together, a plurality of the LEDs may be probed at once using the probe pads instead of probing the LEDs individually.

Embodiments also relate to testing current leakage in the second substrate. A first subset of the LEDs on the final substrate may be connected to a first set of probe pads, traces, conductive components, and transistors. A second subset of the LEDs on the final substrate may be connected to a second set of probe pads, traces, conductive components, and transistors that are designed to be isolated from first subset of the LEDs. When voltage is applied to the first set of probe pads, only the first subset of LEDs that are connected to the first set of probe pads should be turned on. However, if at least a LED in the second subset of LEDs is turned on when voltage is only applied to the first set of probe pads, it indicates that there is current leakage in the second substrate.

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